Product Information:

• iBOND® Etch 35
• iBond® Total Etch is the Etch & Rinse 2-step bonding adhesive.
• Contains 35% Phosphoric Acid
• Due to the innovative nano-filler technology,
• iBond Total Etch attains high bond strength to both enamel
  and dentin while ensuring optimal marginal sealing
• Clinically proven to provide reliable and consistent bond strength
• Dense adhesive layer and good tag formation: leads to improved marginal sealing
• Only one coat required with no agitation
• Demonstrates reduction in postop sensitivity
• Refrigeration not required
• Company: Kulzer